Toho Technology FLX-2320 Thin Film Stress Measurement System
Toho FLX Thin Film Stress Measurement System determines and analyzes thin film stress on various substrates. It determines stress by measuring the curvature change of pre- and post-deposition of the film. This difference in curvature is used to calculate stress by way of Stoney’s equation, which relates the biaxial modulus of the substrate, thickness of the film and substrate, and the radius of curvatures of pre- and post-process. Curvature is measured by directing a laser at a surface with a known spatial angle. The reflected beam strikes a position sensitive photodiode. The geometry of the film is recorded by scanning the surface. Equipped with a heating element for stress monitoring at high temperatures that allows a thorough understanding of film properties at temperatures from RT to 500°C. Sample Size: 75 to 200mm, Maximum Scan Diameter: 200mm, Measurement Range: 1 to 4,000MPa, Minimum Radius: 2.0m, Maximum Radius: 33km.
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