Nano3 Dicing Facility
Nano3 provides dicing services using a Disco Automatic Dicing Saw DAD3220, a precision tool capable of cutting wafers and pieces of silicon, quartz, alumina, III-V materials, and more, up to 6 inches in diameter.
The saw can accommodate die streets (the area to be cut away between die) as narrow as ~20 um for Silicon and ~250 um for glass/sapphire.
Maximum cutting depth is ~1.2 mm.
(Minimum street width is impacted by cutting depth; please inquire for details).
Please send an email to firstname.lastname@example.org with a detailed job description. Our staff will respond with comments/questions/projected timeline and further instructions.
Download and submit our dicing request form with your sample (no requests will be considered without a completed form).
Our goals is 48 hrs for turnaround. Hard substrate materials (e.g. sapphire, quartz), very complex dicing requests, or large volumes of concurrent requests will extend the turnaround. Nano3 dicing staff will communicate if delays are anticipated after receipt of a dicing request.
$31/hr for UC-system users
$80/hr for non-UC-system users
Nano3's dicing saw is located in the "Material Characterization Lab" (Room 1416 Atkinson Hall).
If you have questions please email us at: email@example.com