Nano3: Equipment

Name:

Xactix XeF2 Etcher

Equipment Type:

Description:

XeF2 (xenon difluoride) isotropic silicon etcher. Small parts and wafers up to 100mm in diameter can be accomodated.

Oxford Plasmalab 100 RIE/ICP		Oxford Plasmalab 80+ RIE		Trion RIE/ICP Dry Etcher
Plasma Etch PE100		Plasma-Therm SLR RIE/ICP Plasma Etch System	PVA TePla PS100		Xactix XeF2 Etcher

PLEASE USE FOM FOR EQUIPMENT RESERVATIONS