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Equipment
Name:
TPT Wedge/Ball Bonder
Equipment Type:
Back End Processing
Description:
Bench top, semi-automatic thermosonic wire bonder (TPT HB16) with ball/wedge and wedge/wedge capability. TFT touch panel operator system for easy operation.
Location
1414
Microfluidics Lab
Disco Automatic Dicing Saw 3220
CNC micro milling machine
Keyence VHX1000
PDMS Clean Space
Microfluidics Workstation - Valves controller
West Bond Ball Bonder
West Bond Wedge Bonder
TPT Wedge/Ball Bonder
PLEASE USE FOM FOR EQUIPMENT RESERVATIONS