Ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads to semi-conductor, hybrid or microwave devices. The machine bonds aluminum or gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The bonding tool is guided manually by the operator using hand/eye reference to bond targets and elevations. The bonder is currently set up to use 1 mil (25 um) gold wire through a 90-degree wedge tool. A 45-degree tool is available upon request. The machine performs bonding by using the wedge to mash the wire against the device surface, while applying sideways ultrasonic vibration for a short amount of time. Heat is also applied by a radiating coil around the wedge tool.