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Equipment
Name:
Disco Automatic Dicing Saw 3220
Equipment Type:
Back End Processing
Description:
Precision dicing tool capable of cutting silicon, quartz, alumina and III-V substrates, up to 6 inches in diameter and up to 1mm thick.
Dicing Services
Location
1414
Microfluidics Lab
Disco Automatic Dicing Saw 3220
CNC micro milling machine
Keyence VHX1000
PDMS Clean Space
Microfluidics Workstation - Valves controller
West Bond Ball Bonder
West Bond Wedge Bonder
TPT Wedge/Ball Bonder
PLEASE USE FOM FOR EQUIPMENT RESERVATIONS