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Equipment
Name:
Karl Suss MA6 Mask Aligner
Equipment Type:
Description:
- Exposure modes: contact (soft, hard, low vacuum, vacuum) and proximity.
- Wavelength range UV400 350-450 nm.
- Resolution down to 0.6 um in vacuum contact mode.
- Alignment methods: - Top Side Alignment with accuracy down to 0.5 um. - Bottom Side Alignment with accuracy down to 1 um.
- Wafer size up to 100 mm, pieces down to < 5 mm x 5 mm. Mask size up to 5 inch x 5 inch, Required mask thickness = 90 mil
Location
| Karl Suss MJB3 Mask Aligner | Karl Suss MA6 Mask Aligner | EVG620 Lithography/NIL System | |||||
PLEASE USE FOM FOR EQUIPMENT RESERVATIONS