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Equipment
Name:
EVG620 Lithography/NIL System
Equipment Type:
Photolithography
Description:
EVG620NT Semi-automated Double Side Mask Alignment System (up to 150mm, double side, manual handling)
Broad band UV source
Exposure modes: hard-, soft- and vacuum contact, proximity
Separation distance 0-300 um adjustable via software
Wafer size up to 100 mm, pieces down to 20mmx20mm.
Wafer thickness 0.1 - 10 mm (for top side configuration only)
Mask size 7inchx7inch, 5inchx5inch or 4inchx4inch.
Semi automatic loading with mechanical prealignment on chuck
Quick change of mask and chuck
Tooling for soft UV-Nanoimprinting & Micro Contact Printing
Location
1413
Photolithography
Karl Suss MJB3 Mask Aligner
Karl Suss MA6 Mask Aligner
EVG620 Lithography/NIL System
PLEASE USE FOM FOR EQUIPMENT RESERVATIONS