The New Wave Research QuikLaze-50 ST2 uses Nd:YAG laser ablation to remove a variety of materials commonly found in integrated circuits. Materials can be cut using three wavelengths: 1064, 532 and 355nm with 2x, 10x, 20x and 100x objectives. The setup can be used to trim and correct circuit board components. Minimum cutting size is ~1X1um using the 100X objective.
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