The AJA RF sputter deposition tool may be used for deposition of a variety of dielectrics (oxides, nitrides, etc.). Samples up to four inches in diameter can be accommodated. The system is equipped with a load lock and 5 RF magnetrons arranged in a "sputter-up" configuration. Base pressures in the low 10-9 torr range can be attained. Substrates can be heated up to 800 C, and RF biasing can be employed for pre-cleaning or for film microstructure control during deposition.