EVG620NT Semi-automated Double Side Mask Alignment System
(up to 150mm, double side, manual handling)
- Exposure modes: hard-, soft- and vacuum contact, proximity
- Separation distance 0-300 um adjustable via software
- Wafer size up to 100 mm, pieces down to 20mmx20mm.
- Wafer thickness 0.1 - 10 mm (for top side configuration only)
- Mask size 7inchx7inch, 5inchx5inch or 4inchx4inch.
- Semi automatic loading with mechanical prealignment on chuck
- Quick change of mask and chuck
- Tooling for soft UV-Nanoimprinting & Micro Contact Printing